World's first avalanche p-i-n photodiodes were fabricated on AlN templates for back illumination. Structures with different intrinsic layer thicknesses were tested. A critical electric field of 2.73 MV/cm was estimated from the variation of the breakdown voltage with thickness. From the device response under back and front illumination and the consequent selective injection of holes and electrons in the junction, ionization coefficients were obtained for GaN. The hole ionization coefficient was found to be higher than the electron ionization coefficient as predicted by theory. Excess multiplication noise factors were also calculated for back and front illumination, and indicated a higher noise contribution for electron injection.
Delta (
−) doping is studied in order to achieve high quality p-type GaN. Atomic force microscopy, x-ray diffraction, photoluminescence, and Hall measurements are performed on the samples to optimize the
-doping characteristics. The effect of annealing on the electrical, optical, and structural quality is also investigated for different
-doping parameters. Optimized pulsing conditions result in layers with hole concentrations near 1018 cm−3 and superior crystal quality compared to conventional p-GaN. This material improvement is achieved thanks to the reduction in the Mg activation energy and self-compensation effects in
-doped p-GaN.

Figure 2: (a) (Top bird's eye view) Scanning electron microscope micrograph of an APD, (b,c) Sketch of a Separate Absorption and Multiplication (SAM) GaN APD, and high inherit quantum efficiency p-i-n APDs.